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SD05T1 Series
MAXIMUM RATINGS
Rating
Peak Power Dissipation @ 20 m s (Note 1)
@ T L ≤ 25 ° C
IEC 61000 ? 4 ? 2 (ESD)
IEC 61000 ? 4 ? 4 (EFT)
ESD Voltage (Human Body Model (HBM) Waveform per IEC 61000 ? 4 ? 2)
Total Power Dissipation on FR ? 4 Board (Note 2) @ T A = 25 ° C
Derate above 25 ° C
Thermal Resistance, Junction ? to ? Ambient
Junction and Storage Temperature Range
Lead Solder Temperature ? Maximum (10 Second Duration)
Air
Contact
Symbol
P pk
V PP
° P D °
R q JA
T J , T stg
T L
Value
350
± 15
± 8.0
40
30
300
2.4
416
? 55 to +150
260
Unit
Watts
kV
A
kV
° mW °
mW/ ° C
° C/W
° C
° C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
*Other voltages may be available upon request.
1. Nonrepetitive current pulse, per Figure 6.
2. FR ? 4 printed circuit board, single ? sided copper, mounting pad 1 cm 2 .
ELECTRICAL CHARACTERISTICS
(T A = 25 ° C unless otherwise noted)
Symbol Parameter
I PP
Maximum Reverse Peak Pulse Current
V C
Clamping Voltage @ I PP
I F
I
I R V F
V RWM
I R
Working Peak Reverse Voltage
Maximum Reverse Leakage Current @ V RWM
V C V BR V RWM
I T
V
V BR
I T
Breakdown Voltage @ I T
Test Current
I F
V F
Forward Current
Forward Voltage @ I F
I PP
Uni ? Directional TVS
ELECTRICAL CHARACTERISTICS
Device
V RWM
(V)
I R @ V RWM
( m A)
V BR , Breakdown Voltage
(V)
Min Max
I T
mA
V C @ I PP = 5 A
(Note 3)
(V)
Max I PP
(Note 3)
(A)
V C @ Max I PP
(Note 3)
(V)
Max
Capacitance
(pF)
V R = 0 V
f = 1.0 MHz
SD05T1G
SD12T1G
5.0
12
10
1.0
6.2
13.3
7.3
15.75
1.0
1.0
9.8
19
24
15
14.5
25
350
150
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
3. 8 × 20 m s pulse waveform.
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